Dry Film Applied on FPC thiab PCB
Dry Film Applied on FPC thiab PCB
Khoom siv
Siv rau Printed Circuit Board thiab Flexible Printed Circuit Board, nrog rau qhov zoo ntawm kev ua tau zoo ntawm kev sib tw, kev daws teeb meem thiab adhesion.
Cov qauv khoom
Khoom Specification
| Khoom Code | LK-D1238 LDI Dry Film | LK-G1038 Dry Film |
| Thickness (mm) | 38.0 Nws±2.0 | |
| Ntev (m) | 200ｍ | |
| Dav | Raws li cov neeg siv khoom'thov | |
Khoom Parameters
(1) LK-D1238 LDI Dry Film
LK-D1238 LDI Qhuav Zaj duab xis yog tsim rau cov duab ncaj qha raug tshuab, nrog wavelength ob leeg 355nm thiab 405nm.
| Yam khoom thiab Test method | Cov ntaub ntawv xeem | |||
| Shortest imaging lub sij hawm (1.0wt.% Na2CO3 dej tov, 30℃) *2 | 25s ib | |||
| Wavelength (nm) | 355 | 405 | ||
| Kev ua tau zoo tom qab Imaging | Photosensitivity (*2×2.0) | TSI = 7/21 Kev tawm dag zog * 3 | 20 mJ/cm2 | 15 mJ/cm2 |
| Kev daws teeb meem(*2×2.0) | TSI = 6/21 | 40mm | 40mm | |
| TSI = 7/21 | 40mm | 40mm | ||
| TSI = 8/21 | 50mm | 50mm | ||
| Adhesion (*2×2.0) | TSI = 6/21 | 50mm | 50mm | |
| TSI = 7/21 | 40mm | 40mm | ||
| TSI = 8/21 | 35mm | 35mm | ||
| 【Tending Rkev tsim nyog】*3 10 qhov (6mmf) Tus nqi ntawm qhov tawg (*2×2.0×3 zaug) | TSI = 6/21 | 0% | 0% | |
| TSI = 7/21 | 0% | 0% | ||
| TSI = 8/21 | 0% | 0% | ||
| Striping lub sijhawm kawg (3.0wt.% NaOH dej tov, 50℃) | Luas = 7/21 * 1 Tshaj tawm lub zog | 50s ib | 50s ib | |
(2) LK-G1038 Qhuav Zaj duab xis
LK-G1038 Qhuav Zaj duab xis yog tsim rau kev sib cuag tshuab, nrog lub ntsiab waveleua 365nm.
| Yam khoom thiab Test method | Cov ntaub ntawv xeem | ||
| Shortest imaging lub sij hawm (1.0wt.% Na2CO3 dej tov, 30℃) *2 | 22s ib | ||
| Kev ua tau zoo tom qab Imaging | Photosensitivity (*2×2.0) | TSI = 8/21 Kev tawm dag zog * 3 | 90 mJ/cm2 |
| Kev daws teeb meem (*2×2.0) | TSI = 6/21 | 32.5 ibmm | |
| Luas = 7/21 * 1 | 32.5 ibmm | ||
| TSI = 8/21 | 35mm | ||
| Adhesion (*2×2.0) | TSI = 6/21 | 45mm | |
| TSI = 7/21 | 40mm | ||
| TSI = 8/21 | 35mm | ||
| (Tending Reliability)* 3 10 qhov (6mmf) Tus nqi ntawm qhov tawg (*2×2.0×3 zaug) | TSI = 6/21 | 0% | |
| TSI = 7/21 | 0% | ||
| TSI = 8/21 | 0% | ||
| Striping lub sijhawm kawg (3.0wt.% NaOHwater solution, 50℃) | Luas = 7/21 * 1 Tshaj tawm lub zog | 50s ib | |
(Cov ntaub ntawv saum toj no tsuas yog siv rau kev siv xwb)
Nco tseg:
* 1: Stouffer 21 Theem Exposure Energy Scale.
*2×2.0: Duab nrog ob zaug ntawm lub sijhawm luv tshaj plaws.
* 3: Yog tias tsom mus rau Tending Reliability, nws raug nquahu kom siv lub zog raug nqi ntawm 7~8 qib.
* 4: Cov ntaub ntawv saum toj no yog kuaj los ntawm peb tus kheej cov cuab yeej thiab cov cuab yeej.
Txheej txheem thov
Ceev faj Hauv Kev Thov
(1) Daim Ntawv Thov: Siv cov yeeb yaj kiab no tsuas yog tiv thaiv cov khoom siv hluav taws xob cuam tshuam thiab lwm yam qauv tsim.
(2) Pretreatment: Organic residues, stains vim tsis txaus dewatering thiab ziab ntawm tooj liab nto, tej zaum yuav ua rau polymerization ntawm resisting thiab nkag mus rau ntawm plating los yog etching tov.Thov qhuav kiag li tom qab dej yaug. Tshwj xeeb tshaj yog, thaum cov dej noo nyob hauv lub qhov, nws ua rau lub tsev pheeb suab tawg.
(3) Substrate preheating: Preheating ntawm qhov kub thiab txias rau lub sijhawm ntev yuav ua rau xeb.Nws yuav tsum tau ua kom tsawg dua 10 min ntawm 80 ℃ thiab tsawg dua 3 min ntawm 150 ℃. Thiab thaum lub substrate saum npoo kub ua ntej lamination tshaj 70 ℃, zaj duab xis thickness ntawm ib tug los ntawm lub qhov ntug yuav dhau los ua nyias thiab tej zaum yuav ua rau tenting breakage.
(4) Tuav tom qab lamination thiab raug: Tuav nrog lub teeb thaiv lub teeb lossis hauv qab lub teeb daj (2 meters lossis ntau dua qhov yuav tsum tau muaj). Qhov siab tshaj plaws tuav lub sij hawm nyob rau hauv rooj plaub tom kawg (hauv qab lub teeb daj) yog 4 hnub. Kev nthuav tawm yuav tsum tau ua tsis pub dhau 4 hnub tom qab lamination.Kev tsim kho yuav tsum tau ua tsis pub dhau 3 hnub tom qab raug. Ray ntawm lub teeb tsis-ultraviolet dawb muaj qee cov kab hluav taws xob ultraviolet, yog li tuav nrog lub teeb thaiv los ntawm cov ntawv dub hauv qab nws.Kub kub 23 ± 2 ℃ thiab cov av noo ntawm 60 ± 10% RH. Laminated substrates yuav tsum muab tso rau hauv ib lub khib nyiab ib los ntawm ib qho.
(5) Kev Txhim Kho: Thaum qhov kub ntawm tus tsim tawm tshaj 35 ℃, nws tuaj yeem ua rau cov profile tsis zoo.
(6) Stripping: Tshem tawm hauv ib lub lis piam tom qab lamination.
(7) Kev kho khib nyiab: Cov khoom siv zaj duab xis qhuav hauv tus tsim tawm thiab stripper tuaj yeem coagulated los ntawm neutralization. Cov coagulated Cheebtsam tuaj yeem raug cais tawm ntawm cov tshuaj aqueous los ntawm kev lim xovxwm thiab txoj kev centrifugal. Cov kua dej sib cais muaj qee qhov COD thiab BOD, yog li nws yuav tsum tau muab pov tseg pov tseg kom raug.
(8) Xim xim: Cov xim yog ntsuab / xiav. Txawm hais tias cov xim yuav maj mam discolor nrog lub sij hawm, nws yuav tsum tsis txhob cuam tshuam tus yam ntxwv.
Ceeb Toom Nyob Cia
(1) Thaum khaws cia rau hauv qhov tsaus, txias, thiab qhuav qhov chaw ntawm qhov kub ntawm 5 ~ 20 ℃ thiab cov av noo ntawm 60% RH lossis qis dua, cov zaj duab xis qhuav yuav tsum siv li ntawm 50 hnub tom qab tsim khoom.
(2) Khaws zaj duab xis yob kab rov tav los ntawm kev siv cov racks lossis cov rooj txhawb nqa rau kev khaws cia. Thaum lawv muab tso rau hauv vertically, cov nplooj ntawv ntawm cov yeeb yaj kiab qhuav tuaj yeem plam ib qho los ntawm ib qho thiab yob-puab yuav zoo li xyoob sprout (cov yob tau muab tso rau hauv kab rov tav hauv ib pob).
(3) Tshem tawm cov yeeb yaj kiab los ntawm cov ntawv dub hauv qab lub teeb daj lossis tib yam teeb pom kev zoo. Tsis txhob cia lawv nyob rau hauv lub teeb daj rau lub sijhawm ntev. Npog zaj duab xis yob los ntawm daim ntawv dub thaum koj khaws cia rau lub sijhawm ntev.